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DC1317 (A-H)

Production information
G45 | T40 | Z45 Series Planar Transformer

Forward Active Clamp Topology  
Highest Efficiency attributable to Planar Design. 
Aggressive Interleave by design results in lowest achievable Leakage Inductance.
Multilayer PCB optimization for lowest AC resistance and Proximity Effect . 
Wide variety of Turns Ratios in stock but not shown in Table.
Contact Us   for Module Design and SM Assy of Converter

Table I: G45 Series Recommended Part Numbers and Data Sheets
Ref Design Vin (Min) Vin (Max) Vout Io Champs PN Output Inductor
DC1317A-B (5V) 18 72 5 25 G45R2-0502-05  
DC1317A-C 18 72 12 8 G45R2-0405-05 PQI2050-10-LTC
DC1317A-D 18 72 24 5 G45R2-0408-04 PQI2050-27-LTC
DC1317A-E 36 72 5 12 G45R2-0702-05  
DC1317A-F 9 36 3.3 20 G45R2-0302-07  
DC1317A-F (5V) 9 36 5 20 G45R2-0202-05  
DC1317A-G 9 36 12 8 G45R2-0306-06 PQI2050-16-LTC
DC1317A-G (15V) 9 36 15 7 G45R2-0205-04 PQI2050-27-LTC
DC1317A-G (18V) 9 36 18 6 G45R2-0207-05 PQI2050-27-LTC
DC1317A-G (19.5V) 9 32 19.5 5 G45R2-0207-05 PQI2050-57-LTC
DC1317A-H 9 36 48 1.5 G45R2-0324-06 PQA2050-220-LTC
DC1317A-H (24V) 9 36 24 3 G45R2-0312-06 PQA2050-100-LTC

Table II: G45 Series Equivalent Part Numbers and Data Sheets
Ref Design Vin (Min) Vin (Max) Vout Io Champs PN Output Inductor
DC1317A-A 34 75 3.3 30 G45R2-0601-04 PQL2050-0R650-HX
DC1317A-H 9 36 48 1.5 G45R2-0218-04 PQA2050-220-LTC
DC1317A-H (24V) 9 36 24 4 G45R2-0209-05 PQA2050-100-LTC
1. Consult Linear Tech Ref Design BOM and Schematic for exact device as specified for use by Linear in that Reference
2. In all cases Champs Technologies makes no representation as to suitability of the Reference Design itself as that is the
design responsibility and Intellectual Property of Linear Technology.
3. Champs Technologies responsibility is limited to the use of its component as described in the Data Sheet and any
warranty express or implied is limited to component replacement if found defective.
1. Options supplied as discrete component or integrated into a complete DC-DC Converter Module:
2. Surface Mount Discrete Component Design (as per above Data Sheets). 
3. Discrete Component Implemented in Pad-to-Pad Mounting.
4. Component implemented as Half-Embedded Design + SM Assembly of all components required of DC-DC Converter. 
5. Implemented as a Fully Embedded Design + SM Assembly of all components required of DC-DC Converter.
6. SMT Component Assembly of PCB Including Planar Magnetics Inclusive of Converter Testing. Volume capacity
100K per month.